Siemens Signs An Agreement With Intel
Siemens Signs An Agreement With Intel To Purchase
More Than $2 Billion Of Flash Memories
Intel Corporation and Siemens AG today announced that Intel will provide Siemens high-performance wireless flash memory for next-generation, Internet-ready cell phones and wireless devices.
The agreement between Siemens, a leading vendor of mobile phones for wireless voice and data applications, and Intel, the industry leader in flash memory, features a three-year commitment by Siemens to purchase more than $2 billion of Intel’s high-density, wireless flash memory devices, including advanced Intel® StrataFlash™ memory technologies.
In addition, the companies have agreed to develop new wireless devices using Intel wireless components to enable next-generation audio, video, image and voice communications.
“Siemens is one of the world’s fastest-growing manufacturers of mobile phones, and currently occupies fourth place with a market share of about nine percent,” said Rudi Lamprecht, a member of Siemens AG’s board. “By entering into the supply contract with Intel, we have ensured our ability to respond in the best possible manner to the market demand for Internet-capable, mobile devices over the next few years.”
Siemens is in an ideal position to tackle the third-generation mobile radio market, and is taking the lead in integrating voice and data. “In the future, there will be a wealth of useful mobile applications, and we intend to address the needs of the users with the development of our terminal equipment,” said Lamprecht.
“This agreement with Siemens reflects Intel’s
role as a leading wireless building block supplier to the
Internet economy,” said Ron Smith, senior vice president and
general manager of Intel’s Wireless Communications and
Computing Group. “We look forward to working with Siemens on
using Intel Personal Internet Client Architecture to
accelerate the development of Internet-capable wireless
The Siemens Information and Communication Mobile Group offers a complete range of mobile telephone products including devices, infrastructure and applications. Devices include mobile phones, ISDN phones, mobile organizers, cordless phones and products for wireless home networks. The infrastructure portfolio includes the complete range of network technologies from base stations and switching systems to applications and intelligent networks. More information is available at www.icm.siemens.com.
Siemens AG, headquartered in Munich, is a leading global electronics and engineering company. It employs over 461,000 people in 193 countries, and reported worldwide sales in excess of $74 billion in fiscal 2000 (Oct. 1, 1999 – Sept. 30, 2000). The United States is Siemens’ largest market, with over 73,000 employees and sales of more than $17 billion in fiscal 2000. Siemens is a leading provider of advanced technology solutions in the information and communications, medical, power, automation and control, transportation, and lighting sectors, and leverages its global network of innovation and unparalleled technological heritage to deliver business results for Siemens’ customers around the globe.
Intel’s Wireless Communications & Computing Group is focused on opportunities in the growing cellular and wireless communications and computing areas. Intel’s wireless expertise and set of technologies includes flash memory, chipsets, digital signal processing capabilities, systems engineering and software, and high-performance, low-power processors.
world’s largest chip maker, is also a leading manufacturer
networking and communications products. Additional information about Intel is available at
* Third party marks and brands are property of their respective holders.