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Intel Announces Optical Silicon Solutions

Intel Announces Optical Silicon Solutions To Enable New Telecommunications Services

New Offerings Change How Service Providers Define Network Boundaries, Deploy New Services and Create New Revenue Streams

AUCKLAND, March 2, 2001 - Intel introduced today at the Intel Developers Forum in San Jose, seven optical networking semiconductors that enable telecommunications equipment manufacturers to create new systems that extend the reach of their service provider customers’ optical networks, add intelligence to those networks and deliver new services.

Systems based on these new integrated optical silicon solutions enable service providers to reach new customers without having to install expensive repeaters that boost the signal of traffic traveling long distances over fiber optic cables. These new components are also capable of receiving and transmitting data over multiple communications protocols such as ATM, Packet over SONET, Packet over Fiber and 10 Gigabit Ethernet. This is important to service providers who must support all those multiple protocols if they are to service their customer bases.

“Optical networking equipment based on Intel’s new optical components will enable service providers to reach beyond their existing service boundaries and capture more revenue without increasing their spending,” said Mark Christensen, vice president and general manager of Intel’s Network Communications Group. “In addition, our new optical products give our clients the ability to address the needs of service providers in the metropolitan, long-haul and ultra-long-haul sectors. Our technology allows our clients to reduce their capital spending while gaining greater return on their investment.”

The new optical products complement the growing line of silicon and software offerings within the Intel® Internet Exchange Architecture (Intel IXA), aimed at reducing the development time and increasing the performance of telecommunications equipment.

Intel’s new optical components include the IXF30005 and IXF30007, two optical “digital wrapper” devices that encapsulate multiprotocol data that can be directed to its proper destination through fiber optic cables. These two components use a technology called “forward error correction” (FEC), which corrects errors that corrupt data packets as they travel over long distances, increasing the distance that an optical signal can travel by up to 400 percent. Intel’s new FEC components support data traveling at 10 Gigabits per second (Gbps), a speed known in telecommunications as OC192 – the fastest data speed being implemented by telecommunications service providers today.

When these FEC devices are combined with the IXF6192 Bandwidth Manager, also introduced today, service providers can offer their customers a broad selection of voice and data services, including priority data traffic. The software included with the IXF6192 enables service providers to manage their network configurations and to provision services with a new level of intelligence.

Also announced today are Intel’s optical High Speed Physical Layer (HSPL) components:
 LXT16784/LXT16785 – a 10.0/10.7 Gbps multiplexer/demultiplexer chipset that allows two or more signals to pass over one communications circuit.
 LXT16748/LXT16749 – a 12.5 Gbps multiplexer/demultiplexer chipset for ultra-long-haul applications.
 LXT16742/LXT16743 – a 10.7 Gbps multiplexer/demultiplexer chipset for long-haul/metro applications.
 LXT19908 – a 10 Gbps limiting amplifier that drives laser photonics.

About Intel Internet Exchange Architecture
Intel IXA is an end-to-end family of high-performance, flexible and scalable hardware and software development building blocks designed to meet the growing performance requirements of today’s networks. Based on programmable silicon and software building blocks, Intel IXA solutions enable faster development, more cost-effective deployment and future upgradability of network and communications systems. Additional information can be found at www.intel.com/IXA.

About IDF
The Intel Developer Forum is Intel's premier technical conference, featuring more than 250 sessions and hands-on labs, along with numerous demonstrations of cutting-edge products and technologies. Now in its fifth year, the semi-annual conference provides hardware original equipment manufacturers, and independent hardware and software vendors with in-depth information on Intel technologies and initiatives.

Visit http://developer.intel.com/idf for more information, including information regarding Forums outside the United States. Subscribe to the Intel Developer Update Magazine at http://developer.intel.com/update for updated information throughout the year.

Intel, the world’s largest chip maker, is also a leading manufacturer of computer, networking and communications products. Additional information about Intel is available at www.intel.com/pressroom.
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