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New Intel® Xeon™ Processor Boosts Performance

New Intel® Xeon™ Processor Boosts Performance For Dual Processor Servers And Workstations

Intel Corporation today introduced a new Intel® Xeon™ processor for dual processor servers and workstations with double the on-die cache of previous generations. The new processor helps improve performance by more than 15 percent** and maintain investment protection since it is drop-in compatible with existing systems.

On-die cache is a fast memory reservoir residing on the same chip as the processor. Data stored in the processor's on-die cache is faster to access than data stored on the hard drive or other system memory, enabling better performance, higher data throughput and a larger user capacity.

“These larger cache Intel Xeon processors deliver outstanding performance, price-performance and value to customers,” said HC Hwang, product marketing manager of Intel’s Enterprise Platforms Group in Asia-Pacific. Richard Dracott, group marketing director for Intel’s Enterprise Platforms Group. “Drop-in compatibility with existing Intel-based platforms also provides significant flexibility and extends the life of previous investments.”

The new Intel Xeon processor at 3.06 GHz features a 1 MB level three (L3) cache with a 533 MHz system bus. It is designed for use in general-purpose servers for Web hosting, data caching, search engines, security, streaming media and high performance computing, and in workstations for digital content creation, mechanical and electrical design, financial analysis, and 3D modeling. The new processor complements the latest Intel® Xeon™ processor MP introduced in June, which delivers scalability with leading price-performance for the enterprise application and mid-range data tier, including business logic, application servers and databases.

More than 85 percent of servers shipping today are based on Intel® architecture, according to industry analysts.*** The Intel Xeon processor line played a major role in that success.

The product family is also part of Intel’s “real server” campaign, a program educating mostly small to medium-sized businesses on the benefits of choosing the right servers to meet the demands of enterprise computing. High-bandwidth connections (such as Gigabit Ethernet), high-capacity storage (such as RAID), redundant components and a server operating system with multi-user applications combined with Intel processors help lower operating cost, improve performance and provide room to grow.

The Intel Xeon processor at 3.06 GHz with 1 MB of L3 cache is drop-in compatible with existing systems designed with the Intel® E7501 (for servers) or Intel® E7505 (for workstations) chipsets, Intel® PRO Gigabit Ethernet Network Connections and Intel® Server RAID Controllers. It is also hardware compatible with systems from leading vendors and with Intel Server Products using dual Intel Xeon processors.

Intel, the world’s largest chip maker, is also a leading manufacturer of computer, networking and communications products. Additional information about Intel is available at

Intel and Intel® Xeon are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other names and brands may be claimed as the property of others. ** Source: Dell Computer Corporation: comparing results of SPECjbb2000 benchmark with a Dell PowerEdge 1750 with two Intel® Xeon™ processors at 3.06 GHz, each with 512KB L2 cache, 2 GB RAM, running Microsoft Windows 2000 Advanced Server (SP3) with BEA WebLogic JRockit 32-bit JVM (Build 1.4.1-300903-win-ia32) produced a SPECjbb2000 score of 49,086 ops/s, compared to the new Dell PowerEdge 1750 with two Intel® Xeon™ processors at 3.06 GHz, each with 1MB L3 cache, 2 GB RAM, running Microsoft Windows 2000 Advanced Server (SP3) with BEA WebLogic JRockit 32-bit JVM (Build 1.4.1-300903-win-ia32), which produced a SPECjbb2000 score of 57,653 ops/s (both benchmark results submitted to SPEC ~ July 14, 2003). *** Source: International Data Corp., (IDC), Quarterly Server Tracker, Q1, 2003.

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