Complete Memory Solution For Wireless Handsets
Intel Unveils Complete Memory Solution For Wireless Handsets
Intel StrataFlash® Wireless Memory System Delivers Low-cost Data Storage, Code and RAM in a Single Device
Intel Corporation today unveiled Intel StrataFlash® Wireless Memory System, a complete, cost-effective memory solution specifically designed for next-generation handsets that require memory storage for large embedded data applications such as camera images, audio and video files.
Based on Intel’s Multi-Level Cell (MLC) technology, which doubles the amount of information stored in each memory cell, the system contains code execution, data storage and RAM working space – three types of memory functionality wireless developers require.
The system also features 1.8-volt operation for longer battery life and memory densities up to 1 Gb. It comes in one tiny package that simplifies the design process for wireless handset makers.
“The Intel StrataFlash Wireless Memory System is designed specifically for next-generation handsets that are driving data adoption rates at a rapid pace,” said Ron Smith, senior vice president and general manager of Intel’s Wireless Communications and Computing Group. “Intel offers complete wireless solutions from cost-competitive memory systems to combinations of memory and logic products to simplify designs that add more functionality in a small space, while saving cost for wireless handset makers.” Smith announced the system in his keynote today at the Intel Developer Forum in Taiwan.
The new memory system is based on Intel’s fourth generation of MLC technology and contains a cost-effective segment optimised for data storage. Latest Intel® Stacked Chip Scale Packaging Family Member Intel StrataFlash Wireless Memory System is the latest member of the Intel® Stacked Chip Scale Packaging (Stacked-CSP) product line. By offering a common package pin out and the same Intel® Flash file management software across a range of densities, integration and upgrades are easily made.
This innovative stacking solution from Intel provides new levels of space savings for wireless customers by combining high-density Intel StrataFlash® Wireless Memory with flexible RAM options in densities up to 1Gb in a small package size of 8x11mm. Intel StrataFlash Wireless Memory System (part number LV18/LV30) is currently sampling, with production volumes starting in February. Pricing will vary by specific flash and RAM memory combinations. More information on the Intel StrataFlash Wireless Memory System and Stacked-CSP can be found at www.intel.com/go/wms. About IDF The Intel Developer Forum is the technology industry's premier event for hardware and software developers. Held worldwide throughout the year, IDF brings together key industry players to discuss cutting-edge technology and products for PCs, servers, communications equipment, and handheld clients. For more information on IDF and Intel technology, visit http://developer.intel.com.
Intel, the world's largest chip maker, is also a leading manufacturer of computer, networking and communications products. Additional information about Intel is available at www.intel.com/pressroom
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