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Significant Opportunities In New Era Of Mobility

March 3, 2005

Significant Opportunities In New Era Of Mobility Platforms

Intel Developer Forum, San Francisco, –

Sean Maloney, Intel Corporation executive vice president and co-general manager of Intel’s recently formed Mobility Group, described here today how advances in mobile broadband and smart clients are creating a foundation for a new wave of innovation and significant opportunities for organisations and individuals.

“The industry is driving a new wave of innovation that feels a lot like the early days of the internet era,” said Maloney. “Before internet technologies, there was a tremendous amount of information in computers around the world – but it was locked into one location, one terminal, one user. With the advent of the browser and other technologies, this deluge of data became instantly available to people around the world. “Now, with innovations in Wi-Fi and WiMAX technologies along with developments to make smarter, more efficient laptops, cell phones and PDAs, the industry can help take that experience even further and bring it to more people than ever before. Ultimately, we expect millions of new users to use low-cost wireless technologies to not just get broadband, but mobile broadband. Human beings are inherently mobile – and computing will be too.”

Smarter Mobile Platforms Maloney revealed several new client platform innovations that are making mobile devices smarter and more useful. In his keynote, Maloney demonstrated the next-generation Intel® Centrino™ mobile technology platform (codenamed Napa). The demonstration included Intel’s first 65nm dual-core mobile-optimised processor (codenamed Yonah), a new chipset and next-generation Intel wireless solution.

He also disclosed three new technologies planned for Yonah that will improve the performance, power and design of mobile platforms. They include Intel Digital Media Boost, for rich digital multimedia content creation; Intel Advanced Thermal Manager, for enhanced thermal monitoring, accuracy and responsiveness; and Intel Dynamic Power Coordination, which can automatically adjust the performance and power between the two processing cores on demand.

In addition to showing the latest Intel-designed and manufactured cell phone platform (codenamed Hermon), which will ship later this year, Maloney outlined a compelling roadmap for the future of cell phone platforms that include one- and two-chip configurations with integrated graphics, high-end performance and low-power modules. These configurations give developers greater flexibility to design phones for all segments of the handset market.

Two Become One Mobility in the new era won’t be about selecting a single mobile device or a single network, but rather giving users the freedom to choose between cell phone, notebook or PDA, or even using multiple clients as ‘one logical device’ across networks. The ‘one logical device’ concept is defined as smart and automatic interaction between devices such as notebooks and cell phones, such as having a picture from a camera phone sent wirelessly to a notebook or using a cell phone as a means to make a wireless connection for a notebook.

Broadband Wireless: Coverage is King Wi-Fi adoption continues to grow at a rapid pace, as more and more wireless WAN networks are coming online, and WiMAX developments have progressed. Still, only a small percent of the world’s population has broadband access of any kind.

“Over the last year, we estimate the number of engineers in the industry working on WiMAX-related technologies has increased tenfold. We’ve also seen the number of WiMAX carrier trials increase from two to 15 on its way to more than 75 before the end of 2005 and more than 200 companies have joined the WiMAX Forum,” said Maloney. “This is great progress, but as the data shows, we’ve only achieved limited broadband coverage, which gives our industry a great opportunity to deploy applications and services much more affordably using broadband wireless technologies.”

About IDF Intel Developer Forum is the technology industry’s premier event for hardware and software developers. Held worldwide throughout the year, IDF brings together key industry players to discuss cutting-edge technology and products for PCs, servers, communications equipment and handheld clients. For more information on IDF and Intel technology, visit

Intel, the world’s largest chip maker, is also a leading manufacturer of computer, networking and communications products. Additional information about Intel is available at

Intel and Intel Centrino are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others.


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