Breaking the Barriers to Mobility

Breaking the Barriers to Mobility

Intel is holding its Intel Developer Forum (IDF) October 15-16 in Taipei, Taiwan.
Mooly Eden
Intel Vice President and General Manager
Mobility Platforms Group
Intel Corporation

Describing the latest trends in mobile computing, Mooly Eden highlighted forthcoming Intel platforms for notebooks that build on the mobility attributes of performance, battery life, form factor and wireless communications, and also how these attributes can be extended to new device types and usage models. He also discussed the future of wireless networking connectivity, including mobile WiMAX.

• Santa Rosa Refresh – In January 2008, Intel will launch Santa Rosa Refresh, an update to Intel® Centrino® processor technology that includes the next generation 45nm high-k mobile processor (codenamed Penryn) and improved graphics capabilities. With the Penryn mobile processor, Santa Rosa Refresh-based notebooks receive enhanced performance and battery life features. Graphics improvement for Santa Rosa Refresh focuses on unlocking advanced graphics technologies for an enhanced visual experience, especially with DirectX 10-based applications. Santa Rosa Refresh notebook PCs also contain the Mobile Intel 965 Express chipset family, Intel Next-Gen Wireless-N network connection, Intel 82566MM and 82566MC Gigabit Network Connection and optional Intel Turbo memory.

• Future Mobile Roadmap for Notebooks – Mooly showed the next generation Montevina processor technology Intel is targeting to deliver in mid-2008. Montevina includes the new 45nm high-k Intel Penryn mobile processor and the next-generation chipset with DDR3 memory support. This will be Intel’s first Centrino processor technology for notebooks to offer the option of integrated Wi-Fi and WiMAX wireless technologies for greater wireless broadband access. It will also feature integrated HD-DVD/Blu-ray support for consumers and next generation data manageability and security features for the enterprise. With approximately 40 percent smaller components, Montevina will be ideal for the wide spectrum of notebook designs from sub to full-sized notebooks.

• Wi-Fi – 802.11n/Cisco – Announced on September 4, Cisco and Intel are working together on interoperability testing of 802.11n draft 2.0, helping to ensure reliable performance and compatibility between Intel Centrino-based notebook PCs and Cisco wireless networks.

• WiMAX for Notebooks in 2008 – Mooly highlighted both the quality of the WiMAX network as well as the significant ecosystem working on and supporting this wireless standard, including conformance and interoperability testing. He showed several mobile implementations, all illustrating the benefits of true mobile connectivity using Intel’s Echo Peak, the industry’s first integrated Wi-Fi / WiMAX module solution that will be offered as an option for notebooks based on next-generation Centrino processor technology (Montevina) in 2008.
o Echo Peak incorporates advanced MIMO antenna technology for increased data throughput rates – improving users’ broadband experiences at home, work and on the go. Integrating Wi-Fi and WiMAX into the platform not only frees up valuable laptop real estate for other uses, but also helps yield a highly cost-effective solution, enabling higher device attach rates and better economics.
o A number of OEMs, including Acer, Asus, Lenovo, Panasonic and Toshiba have already expressed intent to embed WiMAX into next-generation Centrino processor technology-based notebook PCs in 2008.

• Powerful Entertainment – As seen in Mooly’s keynote, Intel Centrino processor technology provides robust and high-definition entertainment. He demonstrated the multimedia capabilities of today’s Centrino-based platforms showing high-definition content streaming wirelessly.

About Intel
Intel, the world leader in silicon innovation, develops technologies, products and initiatives to continually advance how people work and live. Additional information about Intel is available at www.intel.com/pressroom and http://blogs.intel.com.

ENDS

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